[ ](http://www.engadget.com/2013/01/10/huawei-8-core-chip-mwc-p-series/)
We never thought our day could get any better after [Huawei's](http://www.engadget.com/tag/huawei/) Consumer Business Group CEO [Richard Yu](http://www.engadget.com/tag/richardyu/) became available again for our CES stage interview (there was originally a "last minute urgent conflict"), but our man was also kind enough to share a couple more scoops with us. First of all, Huawei will be [joining Samsung](http://www.engadget.com/2013/01/09/samsung-announces-exynos-5-octa-chip-at-ces/) at the octa-core Cortex-A15 party in the second half of this year, and given what Yu's told us [earlier this week](http://www.engadget.com/2013/01/08/huawei-hisilicon-k3v3/), our guess is that this will either be the HiSilicon K3V3 or a sister chipset, again manufactured by [TSMC](http://www.engadget.com/tag/tsmc/).
The second scoop of the day was delivered fresh off the stage after the interview. Yu told us exclusively that at MWC next month, Huawei will be unveiling a super slim follow-up to the current P series Android phones. We asked if it'll be even thinner than 6.45mm (the thickness of the [Alcatel One Touch Idol Ultra](http://www.engadget.com/2013/01/07/alcatel-one-touch-idol-ultra/) announced at CES), and Yu said yes. The exec added that the new phone will have a beautiful metallic body as well. Exciting times, right?
Filed under: [Cellphones](http://www.engadget.com/category/cellphones/), [Mobile](http://www.engadget.com/category/mobile/)
**[Comments](http://www.engadget.com/2013/01/10/huawei-8-core-chip-mwc-p-series/#comments)**
**Via:** [Engadget Chinese](http://chinese.engadget.com/2013/01/10/richard-yu-8-core-second-half-2013/)
URL: http://www.engadget.com/2013/01/10/huawei-8-core-chip-mwc-p-series/
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